this document is a general product descript ion and is subject to change without notice. hynix does not assume any responsibilit y for use of circuits described. no patent licenses are implied. rev 0.0 / jul. 2008 1 1 preliminary H27U8G8T2B series 8 gbit (1024 m x 8 bit) nand flash 8 gb nand flash H27U8G8T2B www.datasheet.co.kr datasheet pdf - http://www..net/
rev 0.0 / jul. 2008 2 1 preliminary H27U8G8T2B series 8 gbit (1024 m x 8 bit) nand flash document title 8 gbit (1024 m x 8 bi t) nand flash memory revision history revision no. history draft date remark 0.0 initial draft. jul. 30. 2008 preliminary www.datasheet.co.kr datasheet pdf - http://www..net/
rev 0.0 / jul. 2008 3 1 preliminary H27U8G8T2B series 8 gbit (1024 m x 8 bit) nand flash features summary high density nand flash memories - cost effective solutions for mass storage applications multiplane architecture - array is split into two independent planes. parallel opera- tions on both planes are ava ilable, halving program, read and erase time. nand interface - x8 bus width. - address / data multiplexing - pin-out compatibility for all densities supply voltage - 3.3 v device : vcc = 2.7 v ~3.6 v memory cell array - (4 k + 128) bytes x 128 pages x 2048 blocks page size - (4 k + 128 spare) bytes block size - (512 k + 16 k spare) bytes page read / program - random access : 60 us (max.) - sequential access : 25 ns (min.) - page program time : 800 us (typ.) - multi-plane program time (2 pages) : 800 us (typ.) fast block erase - block erase time: 2.5 ms (typ.) - multi-block erase time (2 blocks) : 2.5 ms (typ.) electronic signature - 1st cycle : manufacturer code - 2nd cycle : device code - 3rd cycle : internal chip numb er, cell type, number of si- multaneously programmed pages. - 4th cycle : page size, block size, organization, spare size - 5th cycle : multiplane information copy back program - fast data copy without external buffer chip enable don't care - simple interface with microcontroller status register - normal status register (read/program/erase) hardware data protection - device locked during power transitions. data retention - 5,000 program/erase cycles (with 4 bit / 528 byte ecc) - 10 years data retention package - H27U8G8T2Btr-bx : 48-pin tsop1 (12 x 20 x 1.2 mm) - H27U8G8T2Btr-bx (lead & halogen free) www.datasheet.co.kr datasheet pdf - http://www..net/
rev 0.0 / jul. 2008 4 1 preliminary H27U8G8T2B series 8 gbit (1024 m x 8 bit) nand flash 1. summary description hynix nand H27U8G8T2B series have 1024 m x 8 bit with spare 32 m x 8 bit capacity. the devi ce is offered in 3.3 v vcc power supply, and with x8 i/o interface. its nand cell provid es the most cost-effective so lution for the solid state mass storage market. the memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. the device contains 2048 blocks, composed by 128 pages. ever y cell holds two bits. a program operation allows to write the 4224 byte page in typical 800 us and an erase operation can be performed in typical 2.5 ms on a 512 k byte block. in addition to this, thanks to multi-plan e architecture, it is possible to program 2 pages a time (one per each plane) or to read 2 pages a time (one per each plane) to erase 2 bl ocks a time (again, one per each plane). as a consequence, multiplane architecture allows program time reduction and erase time reduction. data in the page can be read out at 25ns cycle time per by te. the i/o pins serve as the ports for address and data input/ output as well as command input. this interface allows a re duced pin count and easy migration towards different densities, without any rearrang ement of footprint. commands, data and addresses are sy nchronously introduced using ce, we , re , ale and cle input pin. the on-chip program/erase controller automates all read, program and eras e functions including pulse re petition, where required, and internal verification and margining of data. th e modify operations can be locked using the wp input. the output pin r/b (open drain buffer) signals the status of the device during each operation. in a system with multiple memories the r/b pins can be connected all together to provide a global status signal. the copy back function allows the optimization of defective blocks management: when a page program operation fails the data can be directly programmed in another page inside the same array section without the time consuming serial data insertion phase. data read out after copy back read (both for single and multiplane cases) is allowed. even the write-intensive systems can take advantage of th e H27U8G8T2B series extended reliability of 5 k program/ erase cycles by providing ecc (error correcting code) with real time mapping-out algorithm. the chip supports ce don't care function. this function allows the direct download of the code from the nand flash memory device by a microcontroller, since the ce transitions do not stop the read operation. this device includes also extra features li ke otp/unique id area, read id2 extension. the H27U8G8T2B is available in 48-tsop1 12 x 20 mm. 1.1 product list part number organization vcc range package H27U8G8T2B x8 2.7v ~ 3.6v 48-tsop1 www.datasheet.co.kr datasheet pdf - http://www..net/
rev 0.0 / jul. 2008 5 1 preliminary H27U8G8T2B series 8 gbit (1024 m x 8 bit) nand flash 9 & |